Anh-Tuan Le, PhD., Assoc. Prof.

Department of Nanoscience and Nanotechnology-DoNST

Advanced Institute for Science and Technology (AIST)

Hanoi University of Science and Technology (HUST)

01 Dai Co Viet Street, Hai Ba Trung District, Hanoi 10000, Vietnam

Tel: + 84 4 36230435

Fax: + 84 4 36230293

Email: tuan.leanh1@hust.edu.vn

or         tuan.hast@gmail.com

URL:  www.leanhtuanhust.com

Flexible TEG breaks new power record

Dec 16, 2013

 

Flexible TEG breaks new power record

 

Researchers at the Integrated Nanotechnology Lab at KAUST in Saudi Arabia are the first to have made a thermoelectric generator on flexible silicon. The device, which is capable of generating 30 times more power than previous such generators, might find use in a host of application areas – including mobile phones, laptops, biomedical sensors and other portable devices.

 

 


Flexible TEG

 

Thermoelectric generators (TEGs) convert heat directly into electricity. The devices are good at conducting electricity but poor at conducting heat, and they have a large thermopower (the ratio of the voltage to temperature difference across the device to its temperature difference).

The researchers, led by Muhammad Mustafa Hussain, began by fabricating their TEGs from the 2D layered materials bismuth telluride and antimony telluride on low-cost bulk mono-crystalline silicon. Next, they transformed the devices and the host silicon into flexible and transparent systems using state-of-the-art CMOS-compatible processes. The silicon layer is just 18 µm thick and contains 63 thermopiles.

“The TEGs we made generate 0.15 µW of power, which is 30 times more than previously-made devices of this kind,” Hussain told nanotechweb.org. “The thin silicon contains trenches that serve to minimize heat loss from the hot end of the device to the cold end. The power generated by the finished device is enough to run ultralow power CMOS circuitry in sensors, including some in vivo biomedical devices.”

 

The 30% increase in power output comes thanks to the reduced cross-sectional area of the silicon substrate and the fact that it is very flexible, explains team member Galo Torres Sevilla. The mechanical flexibility also greatly increases the number of potential applications for this type of device, he says, since the platform can be integrated onto a wide variety of surfaces, even irregularly shaped ones.

 

“We believe that the number of applications for these TEGs are virtually unlimited, ranging from consumer electronics such as cellphones, laptops and portable devices to systems that need to be used in hostile and difficult-to-access locations,” added Hussain. “The devices might be particularly suitable for implantable and wearable electronics, and they may even help overcome difficulties inherent in such applications, like reduced lifetime because of battery failure.”

 

The team now plans to fabricate a flexible, high-performance, self-powering system on a chip based on its TEGs. “The main challenge here will be to integrate all the different electronic modules, power generation and storage in a single structure,” explained Hussain. “However, we are confident that we will be able to make such a standalone system in the near future.”

 

The current research is detailed in Small DOI: 10.1002/smll.201301025.